2PI OPTICS

EventsSCITECH FORUM 2026, 2026, legacy_backfill, CES 2026, OFC 2026
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HVM-Ready Imaging Metalens for 12" Wafer-Level IntegrationNo image

HVM-Ready Imaging Metalens for 12" Wafer-Level Integration

This conceptual design illustrates an imaging-grade metalens optimized for High-Volume Manufacturing (HVM) . Engineered for 12" wafer processes , the architecture supports seamless wafer-level integration . While visualized…