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CategoriesAdhesives Including Edgebond, Corner Bond, Cable &, Wire Harness, Component Level Programming Equipment/Services/Software, Component Packaging &, Handling Equipment &, Services Including Die Handling, Component Preparation, Electronic Manufacturing Services Ems/Contract Manufacturer, Encapsulation &, Protection Materials/Equipment, Reach/Rohs Compliance Services
EventsAPEX EXPO
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Products
Showing 1-2 of 2 products
No image PLACE-N-BOND™ Underfilm - Leading Underfilm Alternative
This patented Underfilm exhibits durable adhesive technology made of pre-formed thermoplastic to create corner/edge bonds for BGA/LGA/CSP packages to the PCB. This quick and precise adhesive generates major…
No image ZTACH ACE® - Anisotropic Conductive Epoxy - Underfill Alternative
This patented Underfilm exhibits durable adhesive technology made of pre-formed thermoplastic to create corner/edge bonds for BGA/LGA/CSP packages to the PCB. This quick and precise adhesive generates major…