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CategoriesComponent Manufacturing, Engineering Services, Machine Components, Prototyping, Simulation, Thermal Management
EventsBATTERY SHOW NORTH AMERICA, ELECTRIC & HYBRID VEHICLE TECHNOLOGY EXPO NORTH AMERICA, THE FUTURE OF OPTICAL NETWORKING AND COMMUNICATIONS
Products4
Products
Showing 1-4 of 4 products
No image Heatpipes and Vapor Chambers
Cofan’s heat pipes and Vapor chambers are thermal management devices designed to transfer heat efficiently from one point to another using the principles of phase transition and thermal…
No image Liquid Cooling Cold Plates
Cofan’s Liquid-Cooled Cold Plates are designed to efficiently manage and dissipate heat from high heat-flux devices and power electronics, such as IGBTs, MOSFETs, resistors, and high-power modules. These…
No image Metal Core PCB - Multi Layer for Thermal Control
A Metal Core PCB (MCPCB) is a specialized printed circuit board (PCB) designed to provide superior thermal management by incorporating a metallic substrate —typically aluminum, copper, or an…
No image Skived Fin Heatsink for Cooling IGBT and Other Electronics
A skived fin heatsink is manufactured from a single piece of metal (copper or aluminum). Next, a thin layer of metal is separated from the base metal with…