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Products
Advanced HDI & Rigid-Flex PCB Solutions for Medical Devices
DYCONEX develops and manufactures high-end printed circuit board solutions for demanding medical, industrial and aerospace applications. Our expertise covers advanced HDI, fine-line, rigid-flex and miniaturized PCB technologies designed…
Advanced Packaging Substrates
DYCONEX develops advanced packaging substrates designed for high-density, high-reliability electronic systems where electrical performance, miniaturization and integration are critical. These substrates form the foundation for modern semiconductor packaging,…
Advanced PCB Solutions for Medical and High-Reliability Applicati
DYCONEX is a trusted partner for advanced PCB solutions in the MedTech sector. We specialize in flexible, rigid-flex, and rigid printed circuit boards for miniaturized, high-performance, and highly…
Advantages of Ultra-thin Flexible Materials
Ultra-thin flexible materials enable a new level of miniaturization and design freedom in advanced electronic systems. Their minimal thickness allows circuits to conform precisely to complex geometries, supporting…
Biocompatible LCP Substrates
Liquid Crystal Polymer (LCP) is a high-performance thermoplastic polymer known for its unique structural and physical properties. It offers exceptional electrical, thermal, mechanical, and chemical performance, making it…
DYCONEX Flexible Polyimide Boards
DYCONEX Flexible Polyimide Boards DYCONEX Flexible Polyimide Boards are advanced flexible printed circuit solutions engineered for demanding applications in medical devices, high-reliability electronics and miniaturized systems. Designed with…
Flexible Biocompatible Implant Electrodes
DYCONEX Flexible Biocompatible Implant Electrodes are engineered for long-term implantation in highly demanding medical and neurotechnology applications. Built on advanced flexible polyimide substrates and combined with biocompatible metallization…
Flexible Printed Circuit Board
Flexible polyimide circuit boards are ideal for applications that require folding or bending of the circuitry. Compared to conventional prepregs, flexible acrylic or epoxy adhesives offer significant advantages…
Packaging Substrate
DYCONEX offers high-performance circuit boards designed to meet the most demanding application requirements. Featuring finest line/space resolutions down to 25/35 μm, these boards are built using ultra-thin base…