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CategoriesEquipment-Aoi/Automated, Metrology, Mmwave And High-Speed Interconnect, Post-Packaging Test Equipment/Services Burn-In And System-Level Test, Quality Management System, Wafer-Level Test Equipment/Services Wafer Prob, Parametric, Wire Bonding Equipment
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No image MVP Introduces Updated Versa Series of AOI Systems.
MVP\'s latest Versa platforms are configurable to provide simple 3D inspection and enhanced metrology to allow you meet the most rigorous inspection needs. Combined with our latest software…