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AIVY CompactNo image

AIVY Compact

A customizable and versatile wet dust collector RotoClone Ā® W combines the flexibility of a customizable equipment with the capacity to operate in the most challenging industries. Small,…

REDCleanĀ® NFRNo image

REDCleanĀ® NFR

A customizable and versatile wet dust collector RotoClone Ā® W combines the flexibility of a customizable equipment with the capacity to operate in the most challenging industries. Small,…

RotoCloneĀ® WNo image

RotoCloneĀ® W

A customizable and versatile wet dust collector RotoClone Ā® W combines the flexibility of a customizable equipment with the capacity to operate in the most challenging industries. Small,…

"ALP" Thermally Conductive / Dielectric Layer coated on AluminumNo image

"ALP" Thermally Conductive / Dielectric Layer coated on Aluminum

A substrate delivering both: š”š¢š š” šš¢šžš„šžšœš­š«š¢šœ š¬š­š«šžš§š š­š” and š¬š®š©šžš«š¢šØš« š­š”šžš«š¦ššš„ š¦ššš§ššš šžš¦šžš§š­ šŸ”· š‚šŽšš‘šˆš“š‡š„š‘šŒ š€š‹š is engineered for demanding applications that require reliable šžš„šžšœš­š«š¢šœššš„ š¢š§š¬š®š„ššš­š¢šØš§ and šžšŸšŸš¢šœš¢šžš§š­ š”šžššš­ šš¢š¬š¬š¢š©ššš­š¢šØš§.…

AirGapFiller for better heat flow in Electronic Power ModulesNo image

AirGapFiller for better heat flow in Electronic Power Modules

A substrate delivering both: š”š¢š š” šš¢šžš„šžšœš­š«š¢šœ š¬š­š«šžš§š š­š” and š¬š®š©šžš«š¢šØš« š­š”šžš«š¦ššš„ š¦ššš§ššš šžš¦šžš§š­ šŸ”· š‚šŽšš‘šˆš“š‡š„š‘šŒ š€š‹š is engineered for demanding applications that require reliable šžš„šžšœš­š«š¢šœššš„ š¢š§š¬š®š„ššš­š¢šØš§ and šžšŸšŸš¢šœš¢šžš§š­ š”šžššš­ šš¢š¬š¬š¢š©ššš­š¢šØš§.…

BONDSHEET CURED GlassFree, thermal transmission and insulationNo image

BONDSHEET CURED GlassFree, thermal transmission and insulation

A substrate delivering both: š”š¢š š” šš¢šžš„šžšœš­š«š¢šœ š¬š­š«šžš§š š­š” and š¬š®š©šžš«š¢šØš« š­š”šžš«š¦ššš„ š¦ššš§ššš šžš¦šžš§š­ šŸ”· š‚šŽšš‘šˆš“š‡š„š‘šŒ š€š‹š is engineered for demanding applications that require reliable šžš„šžšœš­š«š¢šœššš„ š¢š§š¬š®š„ššš­š¢šØš§ and šžšŸšŸš¢šœš¢šžš§š­ š”šžššš­ šš¢š¬š¬š¢š©ššš­š¢šØš§.…

THIN LAM – Thermal FR4 for Multilayer PCBsNo image

THIN LAM – Thermal FR4 for Multilayer PCBs

A substrate delivering both: š”š¢š š” šš¢šžš„šžšœš­š«š¢šœ š¬š­š«šžš§š š­š” and š¬š®š©šžš«š¢šØš« š­š”šžš«š¦ššš„ š¦ššš§ššš šžš¦šžš§š­ šŸ”· š‚šŽšš‘šˆš“š‡š„š‘šŒ š€š‹š is engineered for demanding applications that require reliable šžš„šžšœš­š«š¢šœššš„ š¢š§š¬š®š„ššš­š¢šØš§ and šžšŸšŸš¢šœš¢šžš§š­ š”šžššš­ šš¢š¬š¬š¢š©ššš­š¢šØš§.…

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